Leading memory maker SK hynix today announced it has developed a UFS 4.1 storage solution built upon its 321-layer 4D NAND ...

SK Hynix Inc. (or "the company") announced today that it has developed a UFS 4.1 solution product adopting the world's ...

SK Hynix has announced the development of a Universal Flash Storage (UFS) 4.1 solution, incorporating what it states is the ...

Thinner, faster UFS 4.1 lands in 2026 SK hynix is doubling down on its love affair with stacking things high by stuffing 321 ...

Ahn Hyun, President and Chief Development Officer, said that SK hynix plans to complete development of the 321-high 4D ...

Micron showed off a prototype of its 9650 Pro SSD, which uses a PCIe 6.0 x4 interface to deliver sequential reads and writes ...

South Korean chipmaker SK hynix said Thursday it had developed a universal flash storage chip integrating the world’s highest ...

Ahn Hyun, President and Chief Development Officer, said that SK hynix plans to complete development of the 321-high 4D NAND-based SSD for both consumers and data centers within the year. "We are on ...

Ahn Hyun, President and Chief Development Officer, said that SK hynix plans to complete development of the 321-high 4D NAND-based SSD for both consumers and data centers within the year.

SK hynix Inc. (or "the company", www.skhynix.com) announced today that it has developed UFS 4.1 solution product adopting the world's highest 321-layer 1Tb triple level cell 4D NAND flash for ...

SK Hynix Inc., the world’s second-largest memory chipmaker, plans to start producing 321-layer NAND products using its triple-stack technology early next year. Last August, the company showcased a ...