EDN

Wafer Level Chip Size Package

This application note provides guidelines for the use of Wafer Level Chip Size Packages (WLCSP). The information in this application note can be used throughout the various stages of WLCSP use. This ...
Business Wire

Research and Markets: Embedded Wafer-Level-Packages: Fan-out WLP / Chip Embedding in Substrate - The Next Generation of IC Packaging & Substrate Assembly Waves

Things are moving really fast at the moment as this year, we see both Fan-out wafer level packaging and chip embedding into PCB laminate infrastructures emerging at the same time, ramping to high ...
EDN

Reportlinker Adds Embedded Wafer-Level-Packages: Fan-out WLP / Chip Embedding in Substrate

Historically, embedded IC package technology is not new at all: several players such as Freescale with its RCP, Infineon with its eWLB and Ibiden for die embedding into PCB laminated substrates have ...
Electronic Design

Wafer-Level Chip-Scale Package Favors Small-Form-Factor ASICs

A fully qualified, high-performance, low-power and small-form-factor wafer-level chip-scale package (W-CSP) developed by Oki Semiconductor satisfies a wide range of ASIC design demands. Targeting chip ...
Seeking Alpha

Akoustis Completes Qualification of First Wafer-Level-Packages for 5G Mobile & Other Markets

Technology Qualification of Akoustis’ Internally Developed and Manufactured WLP Complete Two Tier-1 5G Mobile RF and First Timing Control Customers Have Accepted New WLP Technology and Packages First ...
Semiconductor Engineering

Fan-Out Wafer Level eWLB Technology As An Advanced System-In-Package Solution

System-in-Package (SiP) technology continues to be essential for higher integration of functional blocks to meet the ever demanding market needs with respect to smaller form factor, lower cost and ...
Business Insider

Akoustis Locks Process Flow for Second Wafer Level Package for XBAW Filters

Charlotte, N.C., May 03, 2021 (GLOBE NEWSWIRE) -- Akoustis Technologies, Inc. (NASDAQ: AKTS) (“Akoustis” or the “Company”), an integrated device manufacturer (IDM) of patented bulk acoustic wave (BAW) ...
Houston Chronicle

(BW) Wafer-Level Packaging Requirements Boost Orders for Jordan Valley Semiconductors' Advanced X-ray Metrology Systems

Semiconductor metrology equipment manufacturer Jordan Valley Semiconductors announced that they have sold, installed and qualified multiple units of their JVX 6200 system to leading memory ...
Nasdaq

Akoustis Completes Wafer Level Package Demonstrator and Ships Sample to Tier-1 Mobile Device OEM

Las Vegas, NV, Jan. 09, 2020 (GLOBE NEWSWIRE) -- Akoustis Technologies, Inc. (NASDAQ: AKTS) (“Akoustis” or the “Company”), an integrated device manufacturer (IDM) of patented bulk acoustic wave (BAW) ...
Digi Times

STATS ChipPAC fan-out wafer-level packaging shipments exceed 1 billion units

STATS ChipPAC has shipped over one billion fan-out wafer level packages (FOWLP), also known in the industry as embedded wafer-level ball grid array (eWLB), according to the company. Save my User ID ...
Semiconductor Engineering

Easing The Stress For Package-Level Burn-In

Considered something of a necessary evil, burn-in of IC packages during production does a great job of weeding out latent defects so they don’t turn into failures in the field. But as AI and ...