The challenge of SIPs goes beyond what it takes to assemble them. Increasing functionality and performance in ICs have driven manufacturers to work with wider and more challenging packaging solutions.

The latest generation of mobile phone handsets and smart phone/PDAs has replaced the PC as the advanced technology driver for the electronics industry. The sheer volume alone (1.2 billion units ...

In the real world, we are slaves to our environment. The decisions we make are dependent on the resources available at any given time. In school, I remember coming up with a binary decision diagram ...

Silicon-in-package is basically a multichip module, but SiP provides higher density, uniqueness and better time-to-market than the commodity MCM. Where MCMs excel in reusability and flexibility, and ...

The IoT represents a rapidly growing market for which high-speed wireless connections suitable for various usage systems are indispensable. The arrival of digital transportation is accelerating this ...

1. The OSD335x is an example of a complete system fitting into a tiny BGA package. We also discussed the advantages SiP brings to the design and manufacturing of semiconductors and how they can be ...

Demand for highly-customized IC sockets will sustain growth momentum in 2021 along with increasing application of SiP (system in package) technology to heterogeneous chips integration, according to ...

We didn’t just take a sip. We took a good long drink of SIP technology in this round of iLabs testing. We gathered more than 50 devices from five SIP server vendors and 13 SIP endpoint vendors to ...