Leading memory maker SK hynix today announced it has developed a UFS 4.1 storage solution built upon its 321-layer 4D NAND ...

Micron showed off a prototype of its 9650 Pro SSD, which uses a PCIe 6.0 x4 interface to deliver sequential reads and writes ...

Thinner, faster UFS 4.1 lands in 2026 SK hynix is doubling down on its love affair with stacking things high by stuffing 321 ...

Ahn Hyun, President and Chief Development Officer, said that SK hynix plans to complete development of the 321-high 4D ...

It was around 10 months ago when SK hynix announced the development of 238-layer triple-level cell (TLC) NAND flash memory, which it markets as "4D" technology, and now it has entered the mass ...

Here’s how it works. SK Hynix could be held as an everyday hero with its latest 238-layer 4D NAND Flash memoryt announcement. Why? Because it's promised to bring the flash new Flash memory ...

SK Hynix demos 321-layer 4D NAND at Flash Memory Summit just weeks after 238-layer parts went in mass production When you purchase through links on our site, we may earn an affiliate commission.

SK hynix is showing off a sample of its 321-layer 1-terabit (Tb) triple-level cell (TLC) "4D" NAND chips, which is notable because it's the first time a chip maker has stacked over 300 layers of ...

SK Hynix has announced the development of a Universal Flash Storage (UFS) 4.1 solution, incorporating what it states is the ...

The 1TB SSD Expansion Card combines a Phison E19T SSD controller with a single 1TB chip of SK Hynix’s ‘4D NAND’. Essentially, these are relatively upper-end mainstream parts combined into a ...

Following the PS1012, the company intends to launch a 122TB model in 2025, using its advanced 321-layer 4D NAND technology. A 244TB model is expected to follow that, probably in 2026, targeting ...